With the development of the electronic information industry, the downstream application fields of the printed circuit board industry are becoming more and more diversified. The application fields involve communication electronics, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense, aerospace and other social sectors of economic industries.

 In recent years, with the rapid development of China's economy and the gradual disappearance of demographic dividend, China's labor costs have also shown a rapid upward trend, resulting in an increase in the operating costs of enterprises. In order to reduce the labor cost of enterprises, manufacturers are transferring industries to inland areas with low labor costs, and introducing new processes and equipment to replace labor and reduce labor costs. Introducing new technology and equipment, developing automation and intelligent manufacturing will continue to promote the rapid development of PCB industry.

Printed circuit boards are classified according to circuit layers: single board, double board and multilayer board. Common multi-layer boards are 4-layer boards or 6-layer boards, and complex multi-layer boards can reach dozens of layers.

PCB multilayer circuit board laminating method, before laminating multilayer circuit boards or substrates,  it is necessary to combine various bulk materials such as inner layer boards, glue and copper with steel plates, paper pads, etc., Complete the top-to-bottom alignment, drop alignment, or registration, so that it can be carefully fed into the press for hot pressing.

       The details of Wenlin laminate machine as follows：